Influence of Temperature on Microelectronics and System Reliability

This book provides a sound scientific basis for achieving system operation without reliability penalties at realistic steady state temperatures. From a physics-of-failure perspective, it explores the temperature effects on electrical parameters of both bipolar and MOSFET devices, identifies models for quantifying temperature effects on package elements, and reviews current guidelines for thermal derating of microelectronic devices. Readers then learn how to use the physics-of-failure models presented for various failure processes and to evaluate the sensitivity of device life to variations in manufacturing defects, device architecture, temperature, and non-temperature stresses.